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HMC-XTB110-WP
Signal Conditioning
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Manufacturer:
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Mfr.Part #:
HMC-XTB110-WP
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Datasheet:
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packingQty:
Tray,0
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packingOption:
Tray
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EDA/CAD Models:
Availability: 4787 PCS
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HMC-XTB110-WP General Description
The HMC-XTB110 is a monolithic ×3 Passive Frequency Multiplier which utilizes GaAs Shottky Diode technology, and exhibits low conversion loss and high Fo isolation. This wideband ×3 multiplier requires no DC power, and is targeted to high volume applications where frequency ×3 of a lower frequency is more economical than directly generating a higher frequency. All bond pads and the die backside are Ti/Au metallized. The HMC-XTB110 Passive ×3 MMIC is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ω environment and contacted with RF probes.
Key Features
- Conversion Loss: 19 dB
- Input Drive: +13 dBm
Application
- E-Band Communication Systems
- Short-Haul/High Capacity Radios
- Automotive Radar
- Test & Measurement Equipment
- SATCOM
Specifications
model | HMC-XTB110-WP | packingQty | Tray,0 |
packingOption | Tray | lifeCycle | production |
Service Policies and Others
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AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.
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Availability: 4787 PCS
+BOMQty. | Unit Price | Ext. Price |
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1+ | - | - |
The prices below are for reference only.
All bill of materials (BOM) can be sent via email to [email protected], or fill below form to Quote for HMC-XTB110-WP, guaranteed quotes back within 12hr.
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