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See Technical Specifications

VB56G4ACGK

Image Sensor Monochrome CMOS 1124x1364Pixels 48-Pin OBGA Tray

Manufacturer:

STMicroelectronics, Inc
Mfr.Part #:

VB56G4ACGK
Datasheet:

VB56G4ACGK Datasheet (PDF)
prmis_id:

CP537824
parent_id:

PF270075
p_4906:

false
p_5113:

0
EDA/CAD Models:

Request Free CAD Models for VB56G4ACGK

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

VB56G4ACGK General Description

The VB56G4A is a 1.5 megapixel global shutter image sensor designed for automotive driver monitoring applications.

Using pre-eminent 3D stacking and ST patented processes, the sensor performs outstandingly in the near infrared region (940 nm). More precisely, thanks to backside illumination technology and its excellent sensitivity, the VB56G4A can be operated with one simple LED or VCSEL.

STMicroelectronics, IncMicrosoft.AspNetCore.Mvc.Localization.LocalizedHtmlString

Key Features

Automotive compliancy
AEC-Q100 grade 2 ongoing
Operating junction temperature: -40°C to 125°C
AEC-Q100 grade 2 ongoing
Operating junction temperature: -40°C to 125°C
Ultra compact 1.5 megapixel image sensor
Global shutter architecture, 3D stacked sensor 40 nm/65 nm
2.61 μm x 2.61 μm BSI (backside illuminated) pixel
1.5 megapixel monochrome sensor (1124 x 1364)
Package: OBGASize: 6.2 mm x 6.9 mmMatrix: 6 x 8 ballsBall pitch: 0.8 mm
Size: 6.2 mm x 6.9 mm
Matrix: 6 x 8 balls
Ball pitch: 0.8 mm
Global shutter architecture, 3D stacked sensor 40 nm/65 nm
2.61 μm x 2.61 μm BSI (backside illuminated) pixel
1.5 megapixel monochrome sensor (1124 x 1364)
Package: OBGA
Size: 6.2 mm x 6.9 mm
Matrix: 6 x 8 balls
Ball pitch: 0.8 mm
Size: 6.2 mm x 6.9 mm
Matrix: 6 x 8 balls
Ball pitch: 0.8 mm
Easy integration
Embedded auto-exposure
Programmable sequences of 4-frame contexts
8 programmable GPIOsNIR (near infrared) illumination control outputs, synchronized with sensor integration periodsPWM (pulse-width modulation) controlMaster/Slave external frame start
Automatic dark calibration
Dynamic pixel-defective correction
Image cropping
Mirror/flip readout
Binning and subsampling (x2 and x4)
Typical power consumption 145 mW at 60 fps
Dual lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane
NIR (near infrared) illumination control outputs, synchronized with sensor integration periods
PWM (pulse-width modulation) control
Master/Slave external frame start
Embedded auto-exposure
Programmable sequences of 4-frame contexts
8 programmable GPIOs
NIR (near infrared) illumination control outputs, synchronized with sensor integration periods
PWM (pulse-width modulation) control
Master/Slave external frame start
NIR (near infrared) illumination control outputs, synchronized with sensor integration periods
PWM (pulse-width modulation) control
Master/Slave external frame start
Automatic dark calibration
Dynamic pixel-defective correction
Image cropping
Mirror/flip readout
Binning and subsampling (x2 and x4)
Typical power consumption 145 mW at 60 fps
Dual lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane
Unique image performance
Peak quantum efficiency 24% @ 940 nm
Linear dynamic range up to 60 dB
Up to 88 frames per second at full resolution
Peak quantum efficiency 24% @ 940 nm
Linear dynamic range up to 60 dB
Up to 88 frames per second at full resolution