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STM32MP157CAD3T

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 257-TFBGA (10x10)

Manufacturer:

STMicroelectronics, Inc
Mfr.Part #:

STM32MP157CAD3T
Datasheet:

STM32MP157CAD3T Datasheet (PDF)
Series:

STM32MP1
Core Processor:

ARM® Cortex®-A7
Number of Cores/Bus Width:

2 Core, 32-Bit
Speed:

209MHz, 650MHz

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

STM32MP157CAD3T General Description

The STM32MP157C/F devices are based on the high-performance dual-core Arm®Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.The STM32MP157C/F devices also embed a Cortex®-M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm®single-precision data-processing instructions and data types. The Cortex®-M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.The STM32MP157C/F devices also embed a 3D graphic processing unit (Vivante®- OpenGL®ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.The STM32MP157C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.The STM32MP157C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

Key Features

Core
- 32-bit dual-core Arm^® Cortex^®-A7
  - L1 32-Kbyte I / 32-Kbyte D for each core
  - 256-Kbyte unified level 2 cache
  - Arm^® NEON™ and Arm^® TrustZone^®
- 32-bit Arm^® Cortex^®-M4 with FPU/MPU
  - Up to 209 MHz (Up to 703 CoreMark^®)
Memories
- External DDR memory up to 1 Gbyte
  - up to LPDDR2/LPDDR3-1066 16/32-bit
  - up to DDR3/DDR3L-1066 16/32-bit
- 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
- Dual mode Quad-SPI memory interface
- Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
Security/safety
- Secure boot, TrustZone^® peripherals, active tamper
- Cortex^®-M4 resources isolation
Reset and power management
- 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
- POR, PDR, PVD and BOR
- On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V)
- Backup regulator (~0.9 V)
- Internal temperature sensors
- Low-power modes: Sleep, Stop and Standby
- DDR memory retention in Standby mode
- Controls for PMIC companion chip
Low-power consumption
- Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
Clock management
- Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator

Specifications

Category	Integrated Circuits (ICs)EmbeddedMicroprocessors	Series	STM32MP1
Core Processor	ARM® Cortex®-A7	Number of Cores/Bus Width	2 Core, 32-Bit
Speed	209MHz, 650MHz	Co-Processors/DSP	ARM® Cortex®-M4
RAM Controllers	DDR3, DDR3L, LPDDR2, LPDDR3	Graphics Acceleration	Yes
Display & Interface Controllers	HDMI-CEC, LCD	Ethernet	10/100Mbps, GbE
SATA	-	USB	USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O	2.5V, 3.3V	Operating Temperature	-40°C ~ 125°C (TA)
Security Features	ARM TZ	Mounting Type	Surface Mount
Additional Interfaces	CAN, Ethernet, I²C, MMC/SD/SDIO, SPDIF, SPI, UART, USB	Base Product Number	STM32
Pin Count	257	Released Date	Sep 25, 2022
Last Modified Date	Mar 7, 2023 4:10 PM UTC