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S25FL128SAGNFI000 +BOM

FLASH - NOR Memory IC 128Mbit SPI - Quad I/O 133 MHz 8-WSON (6x8)

S25FL128SAGNFI000 General Description

FLASH - NOR Memory IC 128Mbit SPI - Quad I/O 133 MHz 8-WSON (6x8)

Key Features

  • Density
  • – 128 Mbits (16 Mbytes)
  • – 256 Mbits (32 Mbytes)
  • Serial Peripheral Interface (SPI)
  • – SPI Clock polarity and phase modes 0 and 3
  • – Double Data Rate (DDR) option
  • – Extended Addressing: 24- or 32-bit address options
  • – Serial Command set and footprint compatible with S25FL-A,
  • S25FL-K, and S25FL-P SPI families
  • – Multi I/O Command set and footprint compatible with
  • S25FL-P SPI family
  • READ Commands
  • – Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR
  • – AutoBoot - power up or reset and execute a Normal or Quad read
  • command automatically at a preselected address
  • – Common Flash Interface (CFI) data for configuration information.
  • Programming (1.5 Mbytes/s)
  • – 256 or 512 Byte Page Programming buffer options
  • – Quad-Input Page Programming (QPP) for slow clock systems
  • Erase (0.5 to 0.65 Mbytes/s)
  • – Hybrid sector size option - physical set of thirty two 4-kbyte sectors
  • at top or bottom of address space with all remaining sectors of
  • 64 kbytes, for compatibility with prior generation S25FL devices
  • – Uniform sector option - always erase 256-kbyte blocks for software
  • compatibility with higher density and future devices.
  • Cycling Endurance
  • – 100,000 Program-Erase Cycles on any sector typical
  • Data Retention
  • – 20 Year Data Retention typical
  • Security features
  • – One Time Program (OTP) array of 1024 bytes
  • – Block Protection:
  • – Status Register bits to control protection against program or
  • erase of a contiguous range of sectors.
  • – Hardware and software control options
  • – Advanced Sector Protection (ASP)
  • – Individual sector protection controlled by boot code or password
  • Spansion® 65 nm MirrorBit Technology with Eclipse™ Architecture
  • Core Supply Voltage: 2.7V to 3.6V
  • I/O Supply Voltage: 1.65V to 3.6V
  • – SO16 and FBGA packages
  • Temperature Range:
  • – Industrial (-40°C to +85°C)
  • – Automotive In-Cabin (-40°C to +105°C)
  • Packages (all Pb-free)
  • – 16-lead SOIC (300 mil)
  • – WSON 6 x 8 mm
  • – BGA-24 6 x 8 mm
  • – 5 x 5 ball (FAB024) and 4 x 6 ball (FAC024) footprint options
  • – Known Good Die and Known Tested Die

Specifications

Part Life Cycle Code Active Reach Compliance Code compliant
Additional Feature IT ALSO CONFIGURED AS 256M X 1 Alternate Memory Width 2
Data Retention Time-Min 20 JESD-30 Code R-PDSO-N8
Memory IC Type FLASH Memory Organization 32MX4
Memory Width 4 Moisture Sensitivity Level 3
Number of Functions 1 Number of Terminals 8
Number of Words Code 32000000 Operating Mode SYNCHRONOUS
Parallel/Serial SERIAL Peak Reflow Temperature (Cel) 260
Serial Bus Type SPI Surface Mount YES
Technology CMOS Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN Terminal Form NO LEAD
Terminal Position DUAL Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE Write Protection HARDWARE/SOFTWARE

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