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OMAPL138BZCE3

IC MPU OMAP-L1X 375MHZ 361NFBGA

Manufacturer: Texas Instruments, Inc
Mfr.Part #: OMAPL138BZCE3
Datasheet: OMAPL138BZCE3 Datasheet (PDF)
Series: OMAP-L1x
Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 375MHz
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OMAPL138BZCE3 General Description

DSP, 32BIT, 375/456MHZ, NFBGA-361; DSP Type:Fixed Point; No. of Bits:32bit; Frequency:456MHz; Flash Memory Size:-; DSP Case Style:NFBGA; No. of Pins:361Pins; No. of I/O's:144I/O's; No. of MIPS:3648; Embedded Interface Type:I2C, SPI, UART, USB; Operating Temperature Min:0°C; Operating Temperature Max:90°C; Core Supply Voltage Min:950mV; Core Supply Voltage Max:1.35V; Product Range:OMAP-L1x Series; RoHS Phthalates Compliant:Yes; MSL:MSL 3 - 168 hours; SVHC:No SVHC (27-Jun-2018)

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Specifications

Category	Integrated Circuits (ICs)EmbeddedMicroprocessors	Mfr	Texas Instruments
Series	OMAP-L1x	Package	Tray
Product Status	Obsolete	Core Processor	ARM926EJ-S
Number of Cores/Bus Width	1 Core, 32-Bit	Speed	375MHz
Co-Processors/DSP	Signal Processing; C674x, System Control; CP15	RAM Controllers	SDRAM
Graphics Acceleration	No	Display & Interface Controllers	LCD
Ethernet	10/100Mbps (1)	SATA	SATA 3Gbps (1)
USB	USB 1.1 + PHY (1), USB 2.0 + PHY (1)	Voltage - I/O	1.8V, 3.3V
Operating Temperature	0°C ~ 90°C (TJ)	Security Features	Boot Security, Cryptography
Mounting Type	Surface Mount	Supplier Device Package	361-NFBGA (13x13)
Additional Interfaces	HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART	Base Product Number	OMAPL138
Contact Plating	Copper, Silver, Tin	Mount	Surface Mount
Number of Pins	361	Weight	789.392471 mg
Core Architecture	ARM	Data Bus Width	32 b
Frequency	375 MHz	Interface	I2C, Parallel, SPI, USB
Max Frequency	375 MHz	Max Operating Temperature	90 °C
Max Supply Voltage	1.32 V	Min Operating Temperature	0 °C
Min Supply Voltage	1.14 V	Number of Bits	32
Number of Cores	2	Number of I/Os	144
Number of Timers/Counters	3	Number of UART Channels	3
Operating Supply Voltage	1.2 V	Packaging	Cut Tape
RAM Size	8 kB	Voltage	1.35 V