Key Features

• OMAP3 Devices:
• MPU Subsystem
• NEON SIMD Coprocessor
• Tile-Based Architecture Delivering up to 1 MPoly/sec
• Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
• Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
• Fine-Grained Task Switching, Load Balancing, and Power Management
• Programmable High-Quality Image Anti-Aliasing
• Fully Software-Compatible with ARM9
• Commercial and Extended Temperature Grades
• ARM Cortex-A8 Core
• ARMv7 Architecture
• TrustZone
• Thumb-2
• MMU Enhancements
• In-Order, Dual-Issue, Superscalar Microprocessor Core
• NEON Multimedia Architecture
• Over 2x Performance of ARMv6 SIMD
• Supports Both Integer and Floating-Point SIMD
• Jazelle RCT Execution Environment Architecture
• Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
• Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
• ARM Cortex-A8 Memory Architecture:
• 112KB of ROM
• 64KB of Shared SRAM
• Endianess:
• ARM Instructions – Little Endian
• ARM Data – Configurable
• External Memory Interfaces:
• General Purpose Memory Controller (GPMC)
• 16-Bit-Wide Multiplexed Address and Data Bus
• Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin
• Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM
• Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)
• Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
• System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)
• Camera Image Signal Processor (ISP)
• CCD and CMOS Imager Interface
• Memory Data Input
• BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface
• Glueless Interface to Common Video Decoders
• Resize Engine
• Resize Images From 1/4x to 4x
• Separate Horizontal and Vertical Control
• Display Subsystem
• Parallel Digital Output
• Up to 24-Bit RGB
• HD Maximum Resolution
• Supports Up to 2 LCD Panels
• Support for Remote Frame Buffer Interface (RFBI) LCD Panels
• 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
• Composite NTSC and PAL Video
• Luma and Chroma Separate Video (S-Video)
• Rotation 90-, 180-, and 270-Degrees
• Resize Images From 1/4x to 8x
• Color Space Converter
• 8-Bit Alpha Blending
• Serial Communication
• 5 Multichannel Buffered Serial Ports (McBSPs)
• 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5)
• 5-KB Transmit and Receive Buffer (McBSP2)
• SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations
• Direct Interface to I2S and PCM Device and TDM Buses
• 128-Channel Transmit and Receive Mode
• Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports
• High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface)
• High-, Full-, and Low-Speed Multiport USB Host Subsystem
• 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface
• One HDQ/1-Wire Interface
• UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
• Three Master and Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
• Removable Media Interfaces:
• Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO)
• Comprehensive Power, Reset, and Clock Management
• SmartReflex Technology
• Dynamic Voltage and Frequency Scaling (DVFS)
• Test Interfaces
• IEEE 1149.1 (JTAG) Boundary-Scan Compatible
• ETM Interface
• Serial Data Transport Interface (SDTI)
• 12 32-Bit General-Purpose Timers
• 2 32-Bit Watchdog Timers
• 1 32-Bit 32-kHz Sync Timer
• Up to General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
• Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
• Discrete Memory Interface
• Packages:
• 1.8-V I/O and 3.0-V (MMC1 Only),