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See Technical Specifications

NCN8025AMNTXG +BOM

Smart Card Interface

Manufacturer:

ON Semiconductor, LLC
Mfr.Part #:

NCN8025AMNTXG
Datasheet:

NCN8025AMNTXG Datasheet (PDF)
Case Outline:

488AK
MSL Temp (°C):

260
Container Type:

REEL
EDA/CAD Models:

Request Free CAD Models for NCN8025AMNTXG

Email: [email protected]

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NCN8025AMNTXG General Description

In terms of form factor, the NCN8025AMNTXG's TSOP-5 package is a compact and space-saving design, making it well-suited for applications where board space is limited. This feature is particularly beneficial for portable and battery-powered devices like smartphones, tablets, and medical devices, where size constraints are a crucial consideration

Key Features

Fully compatible with ISO-7816-3, EMV4.3, UICC and related standards including NDS and other STB standards (Nagravision, Irdeto .)
3 Bidirectional Buffered I/O Level Shifters (C4, C7 and C8)(QFN-24)- 1 Bidirectional I/O Level Shifter (C7)for the QFN-16 compact version
1.8V, 3.0V or 5.0V +/- 5% Regulated Card Power Supply such as ICC ≤ 70 mA
Regulator Power Supply: VDDP = 2.7V to 5.5V (@1.8V), 3.0V to 5.5V (@3.0V) & 4.85V to 5.5V (@5.0V)
Independent Power Supply on Controller Interface: VDD = 2.7V to 5.5V
Handle Class A, B & C smart cards
Short Circuit Protection on all Card Pins
Support up to 27 MHz input clock with internal division ratio 1/1, 1/2, 1/4, 1/8 through CLKDIV1 & CLKDIV2
ESD Protection on Card Pins up to +8kV (Human Body Model)
Activation/Deactivation Sequence (ISO7816 Sequencer)
Fault Protection Mechanisms Enabling Automatic Device Deactivation in case of Overload, Overheating, Card Take-Off or Power Supply Drop-out (OCP, OTP, UVP)
Interrupt Signal /INT for card presence and faults
External Undervoltage Lockout Threshold adjustment on VDD (PORADJ pin) (Except QFN-16)