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K32W061Z +BOM

High Performance and Ultra-Low-Power MCU for Zigbee®,Thread, and Bluetooth LE 5.0 with Built-in NFC option

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High Performance and Ultra-Low-Power MCU for Zigbee®,Thread, and Bluetooth LE 5.0 with Built-in NFC option

High Performance and Ultra-Low-Power MCU for Zigbee®,Thread, and Bluetooth LE 5.0 with Built-in NFC option

I<sub>DD</sub> [typ] (nA)	4.3,7.4,9.5,20.3	Junction Temperature (Min) (℃)	-40
Core: Number of cores (SPEC)	1	GPIO	22
Description	High Performance and Ultra-Low-Power MCU for Zigbee®,Thread, and Bluetooth LE 5.0 with Built-in NFC option	Free Programmable CPU	Arm Cortex-M4
Supply Voltage [Min - Max]	1.9,3.6	Operating Frequency [Max] (MHz)	48
Frequency (Max) (kHz)	48000	Supply Voltage [max] (V)	3.6
Supply Voltage [min] (V)	1.9	I<sub>CC</sub> [typ] (mA)	20.3
I<sub>DD</sub> [typ] (uA)	4300,7400,9500,20300	Memory Size (B)	152000,640000
Supply Voltage [Min to Max] (V)	1.9 to 3.6	Peripheral Type	I²C,SPI,UART
S<sub>RX</sub> [typ] FSK @ 10 kHz BW (dBm)	-100.0	Serial Communication	2 x I²C,2 x SPI,2 x UART
Core Type	1 x Arm Cortex-M4	Number of pins	40
SRAM (Bytes)	152000	I<sup>2</sup>C	2
T<sub>vj</sub> [max] (℃)	125	Security Status	COMPANY PUBLIC
SPI	2	NFC Tag	Y
Max Transmit Power (dBm)	11	Receive Current Consumption (mA)	4.3
Internal Memory Supported	FLASH,SRAM	RX Sensitivity (dBm)	-100
UART	2	Flash (kB)	640
Pad supply (V)	1.9 to 3.6	Junction Temperature (Max) (℃)	125
Junction Temperature (Min to Max) (℃)	-40 to 125	MCU Internal User Flash (SPEC) (kByte)	640
Transmit Current Consumption (mA)	20.3 @ 10dBm,7.4 @ 0dBm,9.5 @ 3dBm	Communication protocol	I²C,SPI,UART
SRAM (kB)	152	Arm Core	Arm Cortex-M4
Master Interface	I²C,SPI,UART	Controller Interface	I²C,SPI,UART