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See Technical Specifications

IS25LQ032B-JBLE +BOM

NOR Flash 32M SPI, 8-pin SOP 208mil ET 2.3-3.6V

Manufacturer:

ISSI, Integrated Silicon Solution Inc
Mfr.Part #:

IS25LQ032B-JBLE
Datasheet:

IS25LQ032B-JBLE Datasheet (PDF)
Part Life Cycle Code:

Obsolete
Reach Compliance Code:

compliant
ECCN Code:

EAR99
HTS Code:

8542.32.00.51
EDA/CAD Models:

Request Free CAD Models for IS25LQ032B-JBLE

Email: [email protected]

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Tel: +852 95804164

IS25LQ032B-JBLE General Description

FLASH - NOR Memory IC 32Mbit SPI - Quad I/O 104 MHz 8-SOIC

Key Features

Industry Standard Serial Interface
- IS25LQ032B: 32Mbit/4Mbyte
- IS25LQ016B: 16Mbit/2Mbyte
- IS25LQ080B: 8Mbit/1Mbyte
- 256-bytes per Programmable Page Standard
- Standard SPI/Dual/Quad Multi-I/O SPI
- Supports Serial Flash Discoverable Parameters
(SFDP)
High Performance Serial Flash (SPI)
- 104 MHz SPI/Dual/Quad Multi-I/O SPI
- 416 MHz equivalent Quad SPI
- 52MB/S Continuous Data Throughput
- Supports SPI Modes 0 and 3
- More than 100,000 erase/program cycles
- More than 20-year data retention
Efficient Read and Program modes
- Low Instruction Overhead Operations
- Continuous data read with Byte Wrap around
- Allows XIP operations (execute in place)
- Outperforms X16 Parallel Flash
Flexible & Cost Efficient Memory Architecture
- Uniform 4 Kbyte Sectors or 32/64 Kbyte Blocks
- Flexible 4, 32, 64 Kbytes, or Chip Erase
- Standard Page Program 1 to 256 bytes
- Program/Erase Suspend and Resume
Low Power with Wide Temp. Ranges
- Single 2.3V to 3.6V Voltage Supply
- 10 mA Active Read Current
- 8 µA Standby Current
- 5 µA Deep Power Down
- Temp Grades:
Extended: -40°C to +105°C
Auto Grade A3: -40°C to +125°C
Note: Extended+ should not be used for Automotive.
Advanced Security Protection
- Software and Hardware Write Protection
- 4x256-Byte dedicated security area with
OTP user-lockable bits.
- 128 bit Unique ID for each device (Call Factory)
Industry Standard Pin-out & Pb-Free Packages1
- M = 16-pin SOIC 300mil
- B = 8-pin SOIC 208mil
- N = 8-pin SOIC 150mil
- F = 8-pin VSOP 208mil
- K = 8-contact WSON 6x5mm
- L = 8-contact WSON 8x6mm
- T = 8-contact USON 4x3mm
- G = 24-ball TFBGA 6x8mm 4x6 (Call Factory)
- H = 24-ball TFBGA 6x8mm 5x5 (Call Factory)
- KGD (Call Factory)
Note1: IS25LQ080B (not available in M, L, G, H)

Specifications

Part Life Cycle Code	Obsolete	Reach Compliance Code	compliant
ECCN Code	EAR99	HTS Code	8542.32.00.51
Clock Frequency-Max (fCLK)	104 MHz	JESD-30 Code	S-PDSO-G8
Length	5.28 mm	Memory Density	33554432 bit
Memory IC Type	FLASH	Memory Width	1
Number of Functions	1	Number of Terminals	8
Number of Words	33554432 words	Number of Words Code	32000000
Operating Mode	SYNCHRONOUS	Operating Temperature-Max	105 °C
Operating Temperature-Min	-40 °C	Organization	32MX1
Parallel/Serial	SERIAL	Peak Reflow Temperature (Cel)	NOT SPECIFIED
Programming Voltage	2.7 V	Seated Height-Max	2.16 mm
Supply Voltage-Max (Vsup)	3.6 V	Supply Voltage-Min (Vsup)	2.3 V
Supply Voltage-Nom (Vsup)	3 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Form	GULL WING	Terminal Pitch	1.27 mm
Terminal Position	DUAL	Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Width	5.28 mm	Programmabe	Verified
Memory Type	Non-Volatile	Memory Format	FLASH
Memory Size	32Mbit	Memory Organization	4M x 8
Memory Interface	SPI - Quad I/O	Clock Frequency	104 MHz
Write Cycle Time - Word, Page	1ms	Voltage - Supply	2.3V ~ 3.6V
Operating Temperature	-40°C ~ 105°C (TA)	Mounting Type	Surface Mount
Base Product Number	IS25LQ032