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See Technical Specifications

EP4CE55F23I7N +BOM

FPGA - Field Programmable Gate Array

Manufacturer:

Intel
Mfr.Part #:

EP4CE55F23I7N
Datasheet:

EP4CE55F23I7N Datasheet (PDF)
Programmabe:

Not Verified
Number Of LABs/CLBs:

3491
Number Of Logic Elements/Cells:

55856
Total RAM Bits:

2396160
EDA/CAD Models:

Request Free CAD Models for EP4CE55F23I7N

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

EP4CE55F23I7N General Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 324 2396160 55856 484-BGA

Key Features

Low-cost, low-power FPGA fabric:
6K to 150K logic elements
Up to 6.3 Mb of embedded memory
Up to 360 18 × 18 multipliers for DSP processing intensive applications
Protocol bridging applications for under 1.5 W total power
Cyclone IV GX devices offer up to eight high-speed transceivers that provide:
Data rates up to 3.125 Gbps
8B/10B encoder/decoder
8-bit or 10-bit physical media attachment (PMA) to physical coding sublayer (PCS) interface
Byte serializer/deserializer (SERDES)
Word aligner
Rate matching FIFO
TX bit slipper for Common Public Radio Interface (CPRI)
Electrical idle
Dynamic channel reconfiguration allowing you to change data rates andprotocols on-the-fly
Static equalization and pre-emphasis for superior signal integrity
150 mW per channel power consumption
Flexible clocking structure to support multiple protocols in a single transceiver block
Cyclone IV GX devices offer dedicated hard IP for PCI Express (PIPE) (PCIe) Gen 1:
×1, ×2, and ×4 lane configurations
End-point and root-port configurations
Up to 256-byte payload
One virtual channel
2 KB retry buffer
4 KB receiver (Rx) buffer
Cyclone IV GX devices offer a wide range of protocol support:
PCIe (PIPE) Gen 1 ×1, ×2, and ×4 (2.5 Gbps)
Gigabit Ethernet (1.25 Gbps)
CPRI (up to 3.072 Gbps)
XAUI (3.125 Gbps)
Triple rate serial digital interface (SDI) (up to 2.97 Gbps)
Serial RapidIO (3.125 Gbps)
Basic mode (up to 3.125 Gbps)
V-by-One (up to 3.0 Gbps)
DisplayPort (2.7 Gbps)
Serial Advanced Technology Attachment (SATA) (up to 3.0 Gbps)
OBSAI (up to 3.072 Gbps)
Up to 532 user I/Os
LVDS interfaces up to 840 Mbps transmitter (Tx), 875 Mbps Rx
Support for DDR2 SDRAM interfaces up to 200 MHz
Support for QDRII SRAM and DDR SDRAM up to 167 MHz
Up to eight phase-locked loops (PLLs) per device
Offered in commercial and industrial temperature grades

Specifications

Programmabe	Not Verified	Number of LABs/CLBs	3491
Number of Logic Elements/Cells	55856	Total RAM Bits	2396160
Number of I/O	324	Number of Gates	-
Voltage - Supply	1.15V ~ 1.25V	Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)

Service Policies and Others

After-Sales & Settlement Related

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Packing

AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.

Warranty

365-Day Product

Quality Guarantee

We promise to provide 365 days quality assurance service for all our products.

Ratings and Reviews

E**y 03/30/2024

It's hot. Degrees 70-80. The back side of the motherboard is a radiator. While outdoors-like norms, closed in the body-instant overheating and shutdown. In short, the temperature regime is hard. I will glue the radiator on the chip itself.

C**b 06/26/2021

Mikruhi as mikruhi delivery a little more than a month to the seller thanks.

N**h 06/03/2020

5 days for delivery to belarus.

L**n 05/08/2020

Received in 20 days. Everything is fine, after the test i will add a tip.