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DA14531-00000FX2

IC RF TxRx + MCU Bluetooth Bluetooth v5.1 2.4GHz 24-WFQFN, FC

Manufacturer:

Renesas Technology Corp
Mfr.Part #:

DA14531-00000FX2
Datasheet:

DA14531-00000FX2 Datasheet (PDF)
Programmable:

Not Verified
Type:

TxRx + MCU
RF Family/Standard:

Bluetooth
Protocol:

Bluetooth v5.1

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

DA14531-00000FX2 General Description

SmartBond TINY™, the world’s smallest and lowest power Bluetooth^® 5.1 System-on-Chip (SoC), brings down the cost of adding Bluetooth Low Energy (LE) in any system and takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at the heart.

The low system cost is achieved through the high level of integration in SmartBond TINY: A complete Bluetooth Low Energy system can be achieved with the addition of six tiny external passives, a crystal and power source. And to lower the barrier of entry, SmartBond TINY is also available in an easy-to-use tiny module incorporating all the needed components, making the addition of Bluetooth Low Energy to any application a simple drop-in.

Record low hibernation and active power consumption ensure long operating and shelf life with even the tiniest, disposable batteries. Based on a powerful 32-bit Arm^® Cortex^®-M0+ with integrated memories and a complete set of analog and digital peripherals, SmartBond TINY is extremely power efficient, delivering a record score of 18300 on the latest EEMBC benchmark for IoT connectivity, IoTMark™.

The DA14531-01 variant of the DA14531 is optimized for peripheral only applications, provides around 25% additional user RAM memory for a typical BLE application compared to the DA14531-00 and is pin-to-pin compatible.

The DA14530 is pin-for-pin compatible with the DA14531 in a 2.2mm x 3.0mm FCGQFN24 package and provides cost savings by operating from an internal LDO, eliminating the cost of a DC/DC inductor.

Available in a tiny 2.0mm x 1.7mm package, the DA14531 is half the size of its predecessor, or any offering from other leading manufacturers. And, it is complemented by a flexible SDK supporting major compilers such as Keil and GCC out of the box.

Key Features

Future proof, compliant with Bluetooth 5.1 (core)
Optimized for disposable products in connected medical, connected consumer
- Designed to work with disposable, even printed batteries
- Works well with smallest capacity batteries, <30mAh
- Supports multiple years of shelf life
- Inrush current can be limited for disposable batteries with high internal resistance
- Package design allows for low cost manufacturing with smallest possible footprint
Only requiring a single 32MHz crystal
In bypass mode no DC/DC inductor required
No boost converter required when working with 1.5V batteries
Production Line Tool for accelerated production ramp up, resulting in faster time to market and shortest production test time per device

Application

Connected consumer:
Beacons, Smart labels, Remote controls, Proximity tags, Connected watches, Stylus pens, Mouse, Toys, Low power sensors, Bluetooth LE add on “BLE pipe” to existing applications
Connected health:
Connected injectors, Inhalers, Glucose monitors, Smart patches, Blood pressure meters, Thermometers
Automotive:
Tire Pressure, Monitoring Systems and low power wireless sensors

Specifications

Category	RF and WirelessRF Transceiver ICs	Series	-
Programmable	Not Verified	Type	TxRx + MCU
RF Family/Standard	Bluetooth	Protocol	Bluetooth v5.1
Modulation	-	Frequency	2.4GHz
Data Rate (Max)	-	Power - Output	2.5dBm
Sensitivity	-94dBm	Memory Size	48kB RAM, 144kB ROM
Serial Interfaces	ADC, GPIO, I²C, SPI, UART	GPIO	12
Voltage - Supply	1.1V ~ 3.3V	Current - Receiving	2.2mA
Current - Transmitting	3.5mA	Operating Temperature	-40°C ~ 85°C
Mounting Type	Surface Mount	Base Product Number	DA14531
Product Category	RF System on a Chip - SoC	Core	ARM Cortex M0+
Operating Frequency	2.4 GHz	Output Power	2.5 dBm
Supply Voltage - Min	1.1 V	Supply Voltage - Max	3.3 V
Supply Current Receiving	2.2 mA	Supply Current Transmitting	3.5 mA
Program Memory Size	32 kB, 144 kB	Minimum Operating Temperature	- 40 C
Maximum Operating Temperature	+ 85 C	Mounting Style	SMD/SMT
Number of I/Os	12 I/O	Product Type	RF System on a Chip - SoC
Factory Pack Quantity	4000	Subcategory	Wireless & RF Integrated Circuits
Technology	Si	Unit Weight	0.010994 oz