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A3P250-FGG144I

Ultra Low Density FPGAs.

A3P250-FGG144I General Description

ProASIC3offers high performance in ultra low density FPGAs, a single-chip solution,small footprint packages, reprogrammability, and an abundance of advancedfeatures.
Key Features
• Low TOC (total cost of ownership)
• System performance of 350 MHz
• Proven Security
• Protection from Overbuilding andCloning
• Exceptional Reliability

a3p250-fgg144i

Key Features

  • 3K logic elements
  • 36Kb RAM
  • 1Kb FlashROM
  • 1 PLL in CCC
  • Temperature - Commercial, Industrial, Automotive, Military

Specifications

Mask XF022 LeadContent Pb-FREE
RestrictionLevel STANDARD PackingMedia TRAY
TempLevel Industrial TempRange -40C to +85C
Stage REL LeadCount 144
ProductClassDescription Industrial Temp (I) PackingMediaDescription Tray
Weight 5.5555E-05

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Packing

AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.

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Ratings and Reviews

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A
A**n 10/22/2023

Well packed.It came quickly.

19

Reviews

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