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A3P030-QNG48 +BOM

FPGA - Field Programmable Gate Array A3P030-QNG48

A3P030-QNG48 General Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 34 48-VFQFN Exposed Pad

Key Features

  • High Capacity
  • 15 k to 1 M System Gates
  • Up to 144 kbits of True Dual-Port SRAM
  • Up to 300 User I/Os
  • Reprogrammable Flash Technology
  • 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
  • Instant On Level 0 Support
  • Single-Chip Solution
  • Retains Programmed Design when Powered Off
  • High Performance
  • 350 MHz System Performance
  • 3.3 V, 66 MHz 64-Bit PCI†
  • In-System Programming (ISP) and Security
  • ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM®-enabled ProASIC®3 devices) via JTAG (IEEE 1532–compliant)†
  • FlashLock® to Secure FPGA Contents
  • Low Power
  • Core Voltage for Low Power
  • Support for 1.5 V-Only Systems
  • Low-Impedance Flash Switches
  • High-Performance Routing Hierarchy
  • Segmented, Hierarchical Routing and Clock Structure
  • Advanced I/O
  • 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
  • 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
  • Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V
  • Bank-Selectable I/O Voltages—up to 4 Banks per Chip
  • Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and LVCMOS 2.5 V / 5.0 V Input
  • Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above)
  • I/O Registers on Input, Output, and Enable Paths
  • Hot-Swappable and Cold Sparing I/Os‡
  • Programmable Output Slew Rate† and Drive Strength
  • Weak Pull-Up/-Down
  • IEEE 1149.1 (JTAG) Boundary Scan Test
  • Pin-Compatible Packages across the ProASIC3 Family
  • Clock Conditioning Circuit (CCC) and PLL†
  • Six CCC Blocks, One with an Integrated PLL
  • Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback
  • Wide Input Frequency Range (1.5 MHz to 350 MHz)
  • Embedded Memory†
  • 1 kbit of FlashROM User Nonvolatile Memory
  • SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†
  • True Dual-Port SRAM (except ×18)
  • ARM Processor Support in ProASIC3 FPGAs
  • M1 ProASIC3 Devices—ARM®Cortex™-M1 Soft Processor Available with or without Debug

Specifications

Part Life Cycle Code Active Reach Compliance Code compliant
ECCN Code EAR99 HTS Code 8542.31.00.01
Factory Lead Time 40 Weeks Clock Frequency-Max 350 MHz
JESD-30 Code S-XQCC-N48 Length 6 mm
Moisture Sensitivity Level 3 Number of CLBs 768
Number of Equivalent Gates 30000 Number of Terminals 48
Operating Temperature-Max 85 °C Operating Temperature-Min
Organization 768 CLBS, 30000 GATES Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V Supply Voltage-Nom 1.5 V
Surface Mount YES Technology CMOS
Temperature Grade COMMERCIAL Terminal Form NO LEAD
Terminal Pitch 0.4 mm Terminal Position QUAD
Width 6 mm

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