Core Board Solution based on NXP S32V234 for ADAS Applications

NXP S32V234 minimum system core board solution - Lion Core Board, designed for high performance and high security vision and sensor fusion applications, can meet automotive, industrial, consumer applications, meet the needs of ADAS, robotics and other products.

The expansion interface on the board is designed according to MXM 3.0 interface specifications. Customers only need to design functional daughter boards according to their needs to quickly realize platform function development, effectively shortening hardware development time and helping customers' products enter the market quickly.

S32V324 Package type: 621 FC-BGA, package size as follows:

-17x17mm FCPBGA 0.65mm pitch

-Die thickness: 30mil (780μm)

-Die size: 7.62mm x 7.51mm

-SRO: 0.35mm SMD

-Solder Ball: 96.5Sn3.5Ag 0.40mm

From the package size, it can be seen that the S32V design difficulties:

① S32V system is large, the number of power supply circuit is relatively large, Power Tree design complex;

② More pin multiplexing functions, need to pay close attention to the design of the function selection and voltage domain;

③ High frequency signals, part of the power supply current is relatively large, Layout requirements are high;

④ S32V has many balls and small Pitch spacing

In order to ensure higher performance of S32V, we recommend in hardware design that

① The impedance of critical traces must be planned in advance.

② High-speed signals must have reference planes on adjacent layers to minimize crosstalk.

③ Use second-order blind buried-hole design and 8 or more layers of PCB iterative structure, and also recommend the device to be designed with double-sided SMD, as follows:

In order to shorten the customer's S32V R&D time and reduce the cost of board making, SEPIN Group introduces Lion Core Board solution. Customers can make the S32V minimum system core board and the functional backplane to meet their needs separately. The functional backplane does not need to consider too much the high design requirements of S32V, and only needs to reserve MXM3.0 interface to connect with Lion Core Board, which greatly saves the R&D time and board making cost.

Schematic Design Summary:

(1) The S32V can use an external 24/40 MHz crystal to provide the clock, and the reset circuit is recommended to add a delay circuit to ensure the success rate of the boot

(2) DDR circuit: S32V contains 2*32bit DRAM controller, supporting LPDDR2, DDR3/DDR3L and other standard interfaces, the maximum capacity of the controller supports 8Gbits, and the maximum operating clock speed can reach 533MHz.

(3) eMMC circuit: S32V supports eMMC 4.4/5.0 interface protocol and High speed (52MHz) Mode. eMMC boot is only supported by S32V at 3.3V.

(4) S32V's Core, CPU, and GPU power supplies are all powered by 1V, and the current can reach 10A at maximum.

PCB design summary:

(1) DDR all recommended line widths: 4mil minimum, 6mil nominal, 3W line width spacing between different signal groups, differential pairs of alignments to maintain 1 times the line width spacing, signal alignments must have a complete reference surface to ensure the continuity of impedance

(2) The eMMC alignment should be wrapped around the whole group as much as possible, and the length error of the alignment should be controlled within 400mil; pay attention to the power supply alignment away from the high-speed signal line, and control the ripple less than 80mV

(3) The decoupling capacitor of the DCDC input power supply is close to the PMIC side, the output capacitor is close to the inductor side, and ensure that there are enough ground vias at the negative end of the capacitor to ensure the decoupling effect, and there are at least 4*4 0.4*0.2mm vias on the EPAD pad to enhance the heat dissipation of the chip.

►Display board photo

►Scene Application Diagram 2

►Core Technology Advantage

① S32V234 super processing power, Cortex-M4 + 4 core Cortex-A53, main frequency up to 1 GHz, including GPU, APEX2 professional image acceleration processing unit, can meet the needs of different fields of vision-based applications such as automotive, industrial and consumer

② Built-in ISP image signal processing module, supporting up to 8 channels of simultaneous camera image input

③ Automotive Safety level, ISO26262 certification, automotive safety level up to ASIL-B.

④ Modular, can be matched with different functional backplanes to meet different product requirements

►Specifications

① NXP S32V234 minimum system with 1GB DDR3L, 16GB eMMC, power management chip PF8200

② Standardized MXM 3.0 interface specification, which means customers can quickly import S32V234 platform, customers can design functional backplane according to product requirements, greatly shorten the hardware design cycle

③ Module size: 82.0mm x 63.3mm