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See Technical Specifications

W25Q16JVUXIQ +BOM

Contains 2M x 8 memory cells

Manufacturer:

WINBOND
Mfr.Part #:

W25Q16JVUXIQ
Other Name:

W25Q16JVUXIQ TR
Datasheet:

W25Q16JVUXIQ Datasheet (PDF)
ECCN (US):

EAR99
SVHC:

Yes
Automotive:

No
PPAP:

No
EDA/CAD Models:

Request Free CAD Models for W25Q16JVUXIQ

W25Q16JVUXIQ General Description

Packaged in a compact 8-pin SOIC package, this chip is designed for easy integration within existing designs. Additionally, its RoHS compliance underscores its commitment to environmentally friendly manufacturing practices, aligning with global standards for lead-free production. The W25Q16JVUXIQ stands out as a reliable and versatile solution for businesses seeking top-tier performance and security in their memory storage requirements

Specifications

ECCN (US)	EAR99	Part Status	Active
SVHC	Yes	Automotive	No
PPAP	No	Cell Type	NOR
Chip Density (bit)	16M	Architecture	Sectored
Boot Block	No	Block Organization	Symmetrical
Address Bus Width (bit)	24	Sector Size	4Kbyte x 512
Page Size	256byte	Number of Bits/Word (bit)	8
Number of Words	2M	Programmability	Yes
Timing Type	Synchronous	Max. Access Time (ns)	6
Maximum Erase Time (s)	25/Chip	Maximum Programming Time (ms)	3/Page
Interface Type	Serial (SPI, Dual SPI, Quad SPI)	Minimum Operating Supply Voltage (V)	2.7
Typical Operating Supply Voltage (V)	3\|3.3	Maximum Operating Supply Voltage (V)	3.6
Programming Voltage (V)	2.7 to 3.6	Operating Current (mA)	25
Program Current (mA)	25	Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85	Supplier Temperature Grade	Industrial
Command Compatible	Yes	ECC Support	No
Support of Page Mode	No	Minimum Endurance (Cycles)	100000
Packaging	Tube	Mounting	Surface Mount
PCB changed	8	Pin Count	8
Package/Case	UFDFN-8