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HCPL-M601 +BOM

Robust SOP-5 package for maximum isolation and compact design flexibility

email Email: [email protected]
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tel Tel: +852 95804164

Key Features

  • Surface Mountable
  • Very Small, Low Profile JEDEC Registered Package Outline
  • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes
  • Internal Shield for High Common Mode Rejection (CMR)
  • HCPL-M601: 10,000 V/μs at VCM = 50 V
  • HCPL-M611: 15,000 V/μs at VCM = 1000 V
  • High Speed: 10 Mbd
  • LSTTL/TTL Compatible
  • Low Input Current Capability: 5 mA
  • Guaranteed ac and dc Performance over Temperature: –40°C to 85°C
  • Safety and regulatory approvals:
  • - UL recognized: 3750 Vac for 1 min. per U.L. (File No. 55361)
  • - CSA component acceptance Notice #5
  • - IEC/EN/DIN EN 60747-5-2 approved for HCPL-M601/M611 Option 060.
  • Lead Free Option

Specifications

Part Life Cycle Code Active Reach Compliance Code
HTS Code 8541.40.80.00 Additional Feature TTL COMPATIBLE, UL RECOGNIZED
Configuration SINGLE Data Rate-Nom 10 MBps
Forward Current-Max 0.02 A Forward Voltage-Max 1.7 V
Isolation Voltage-Max 3750 V JESD-609 Code e0
Mounting Feature SURFACE MOUNT Number of Elements 1
Number of Functions 1 On-State Current-Max 0.05 A
Operating Temperature-Max 85 °C Operating Temperature-Min -40 °C
Optoelectronic Device Type LOGIC IC OUTPUT OPTOCOUPLER Power Dissipation-Max 0.085 W
Response Time-Max 7.5e-8 s Supply Voltage-Min 4.5 V
Surface Mount YES Terminal Finish Tin/Lead (Sn/Pb)

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