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Device Package: MLP55-27L
(2 related parts in total)
- The MLP55-27L is a Micro Leadframe Package (MLP), also widely known as a Quad Flat No-Lead (QFN) package. It is a mainstream, industry-standard surface-mount package prized for its excellent balance of compact size, thermal performance, and electrical characteristics.
- This package features a 5mm x 5mm body with 27 peripheral leads (pins) on a 0.4mm pitch. It has an exposed thermal pad on the bottom for direct soldering to the PCB, which aids heat dissipation. The mounting style is surface-mount technology (SMT).
- Engineers select the MLP55-27L for space-constrained designs requiring efficient heat removal from power-hungry ICs. Its low-inductance leads and compact footprint make it ideal for high-frequency and portable applications.
- Typical ICs in this package include power management units (PMICs), audio amplifiers, RF transceivers, and microcontrollers. It is commonly found in smartphones, tablets, wearables, and IoT devices.
- PCB layout must carefully manage the large central thermal pad, using a pattern of vias to transfer heat to internal ground planes. Stencil design for solder paste is critical to avoid bridging on the fine 0.4mm pitch and ensure proper voiding for the thermal pad.
- Compared to a similar-pitch TSSOP, the MLP55-27L offers a significantly smaller footprint, superior thermal performance via its exposed pad, and better high-frequency behavior due to shorter leads, though it can be slightly more challenging to visually inspect after soldering.
| Mfr.Part# | Description | Manufacturer | In Stock | Operation |
|---|---|---|---|---|
| SIC478ED-T1-GE3 | Step-down type Adjustable 800mV~24V 5A 4.5V~55V MLP55-27L(5x5) DC-DC Converters ROHS | Vishay Intertechnology, Inc | 7,232 | Add to BOM |
| SIC479ED-T1-GE3 | Step-down type Adjustable 800mV~24V 3A 4.5V~55V MLP55-27L(5x5) DC-DC Converters ROHS | Vishay Intertechnology, Inc | 5,838 | Add to BOM |
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