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See Technical Specifications

SPC5516EAVMG80 +BOM

MCU 32-bit e200z0/e200z1 RISC 1MB Flash 3.3V/5V Automotive 208-Pin MAP-BGA Tray

Manufacturer:

NXP Semiconductor
Mfr.Part #:

SPC5516EAVMG80
Datasheet:

SPC5516EAVMG80 Datasheet (PDF)
Flash (kB):

1000
RAM (kB):

64
Core Type:

e200
Core Number Of Cores (SPEC):

2
EDA/CAD Models:

Request Free CAD Models for SPC5516EAVMG80

SPC5516EAVMG80 Information

General Description

Designed for body electronics, the NXP? MPC5510 MCU belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle.Offers high-performance while continuing to meet low-power requirementsEnables centralized architectures, which reduce the number of distributed ECUs and complexity of vehicle architecturesProvides extensive communication capabilities (e.g., FlexRay, multiple CAN and LIN support)Offers room to grow with scalable family ranging from 512 KB up to 1.5 MB of embedded flashBacked by a third-party ecosystem of development tools and software

Key Features

NXP 32-bit MCU, Power Arch, 1MB Flash, 80MHz, -40/+125degC, Automotive Grade, MAPBGA 208

Application

Automotive
Industrial

Specifications

Flash (kB)	1000	RAM (kB)	64
Core Type	e200	Core: Number of cores (SPEC)	2
Operating Frequency [Max] (MHz)	80	CAN	5
I<sup>2</sup>C	1	SPI	4
GPIO	137	Ambient Operating Temperature (Min to Max) (℃)	-40 to 125
Supply Voltage [min] (V)	4.5	Supply Voltage [max] (V)	5.25
Package/Case	BGA208