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SC18IS602BIPW +BOM

I2C Bus Controller

SC18IS602BIPW Information

Description

The introduction to the NXP SC18IS602BIPW chip is a I2C-bus to SPI bridge, ideal for industrial automation applications. It enables simple and effective system integration with robust design for harsh environments and compact package supporting space-saving designs. This IC provides high-speed serial communication with flexible protocol conversion options, low power consumption for extended battery life, and fast-mode I2C and SPI data transfer. Its primary application is in embedded systems such as industrial automation, robotics, and communication devices, where it interfaces with I2C and SPI devices. Additionally, it can also be used in consumer electronics for connecting microcontrollers to peripherals like sensors, displays, and memory components. With its compact package and flexible protocol conversion options, the SC18IS602BIPW IC simplifies system integration and provides reliable data transfer.

Features

According to the product information, some of the key features of the SC18IS602BIPW are:

  • Bridges I2C bus to SPI protocol for simplified system integration
  • Robust design for harsh environments
  • Compact package for space-saving designs
  • Low power consumption for extended battery life
  • Flexible protocol conversion options for diverse devices
  • High-speed serial communication
  • Fast-mode I2C and SPI data transfer

The device is designed for industrial automation, robotics, and communication devices, and can also be used in consumer electronics. These features enable reliable and efficient data transfer between different types of devices, making it a suitable solution for various applications.

Package

The package type of SC18IS602BIPW is TSSOP-16.

Pinout

The SC18IS602BIPW has a TSSOP-16 package with the following pinout:

  • VCC (Pin 1): Power supply voltage
  • GND (Pins 2, 3, 10, 11, 14, 15): Ground
  • SCK (Pin 4): Serial clock input/output
  • MOSI (Pin 5): Master out slave in serial data input/output
  • MISO (Pin 6): Master in slave out serial data input/output
  • I2C_SDA (Pins 7, 8): I2C serial data input/output
  • I2C_SCL (Pins 9, 12): I2C serial clock input/output
  • INT (Pin 13): Interrupt output
  • NC (Pins 16): No connect

The SC18IS602BIPW is an I2C-bus to SPI bridge that allows for easy communication between devices using different protocols.

Manufacturer

The manufacturer of the SC18IS602BIPW is NXP Semiconductors, a leading global semiconductor company that specializes in designing and manufacturing microcontrollers, processors, sensors, and other semiconductor products for various industries such as automotive, industrial, consumer, and medical devices.

Applications

According to the product information, SC18IS602BIPW is primarily used in: 1. Embedded systems for industrial automation, robotics, and communication devices. 2. Consumer electronics for connecting microcontrollers to peripherals like sensors, displays, and memory components. These application areas require the I2C-bus to SPI bridge's features such as protocol conversion, low power consumption, rugged design, and compact packaging.

Equivalent

The equivalent products of SC18IS602BIPW are:

  • NXP PCA9611A
  • Texas Instruments PCAL6416A
  • STMicroelectronics PCA9605A
  • Microchip Technology MCP3492

These ICs offer similar functionality as the SC18IS602BIPW, providing a bridge between I2C and SPI protocols.

Specifications

Source Content uid SC18IS602BIPW Part Life Cycle Code Obsolete
Pin Count 16 Reach Compliance Code
HTS Code 8542.31.00.01 Address Bus Width
Bus Compatibility I2C Clock Frequency-Max 18 MHz
External Data Bus Width JESD-30 Code R-PDSO-G16
JESD-609 Code e4 Length 5 mm
Moisture Sensitivity Level 1 Number of Terminals 16
Operating Temperature-Max 85 °C Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260 Qualification Status Not Qualified
Seated Height-Max 1.1 mm Supply Current-Max 16 mA
Supply Voltage-Max 3.6 V Supply Voltage-Min 2.4 V
Supply Voltage-Nom 3 V Surface Mount YES
Technology CMOS Temperature Grade INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Terminal Form GULL WING
Terminal Pitch 0.65 mm Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30 Width 4.4 mm
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, I2C Package/Case TSSOP-16

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Ratings and Reviews

More
J
J**n 11/28/2024

All good!!! I recommend!))

6
J
J**n 07/06/2020

Very good quality. Thanks

12

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