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MX25L6406EMI-12G

In Stock: 4,735

Demonstration of Product Description for Development

Manufacturers:
Macronix International
Mfr.Part#:
MX25L6406EMI-12G
Datasheet:
MX25L6406EMI-12G Datasheet (PDF)
Package/Case:
SOP-16
Product Type:
Memory
RoHS:
Lifecycle:
NRND
EDA/CAD Models:
Request Free CAD Models for MX25L6406EMI-12G

MX25L6406EMI-12G Information

Description

The Macronix MX25L6406EMI-12G is a 64Mb (8,192K x 8) flash memory chip designed for industrial and consumer applications. It features high performance read and program speed, low power consumption, and a wide operating voltage range. This SOIC-16 packaged chip offers multiple block protection options, flexible architecture with multiple interface options, and the ability to wake up from power-down mode. Its applications include networking equipment, industrial computers, automotive systems, consumer electronics, medical devices, telecommunications devices, security and surveillance systems, gaming consoles, and embedded systems. The MX25L6406EMI-12G is suitable for use in solid-state drives (SSDs), data storage, and other applications where high-speed, low-power flash memory is required.

Features

The MX25L6406EMI-12G features:

64Mb (8,192K x 8) flash memory
High performance read and program speed
Low power consumption
Wide operating voltage range
Wakeup from power-down mode
Multiple block protection options
Flexible architecture with multiple interface options

These features make it suitable for various applications such as networking equipment, industrial computers, automotive systems, consumer electronics, medical devices, telecommunications devices, security and surveillance systems, gaming consoles, and embedded systems.

Package

The package type of MX25L6406EMI-12G is SOIC-16 (Small Outline Integrated Circuit - 16 pins).

Pinout

The MX25L6406EMI-12G has a pin count of 16 (SOIC-16 package). The pin functions are:

VCC: Power supply
GND: Ground
WP: Write protect
HOLD: Hold input
DQ0-DQ15: Data bus
CE#: Chip enable
WE#: Write enable
RE#: Read enable

This is a 64Mb (8,192K x 8) flash memory chip with multiple interface options and features like low power consumption, wide operating voltage range, and flexible architecture.

Manufacturer

The manufacturer of the MX25L6406EMI-12G is Macronix, a Taiwanese company that specializes in designing and manufacturing flash memory products, including NOR flash, NAND flash, and other types of non-volatile memory solutions.

Applications

The MX25L6406EMI-12G is a flash memory chip with various applications, including:

Networking equipment
Industrial computers
Automotive systems
Consumer electronics
Medical devices
Telecommunications devices
Security and surveillance systems
Gaming consoles
Embedded systems
Solid-state drives (SSDs)

It's suitable for use in a wide range of industries and products.

Specifications

ECCN (US)	EAR99	Part Status	NRND
HTS	8542.32.00.71	Automotive	No
PPAP	No	Cell Type	NOR
Chip Density (bit)	64M	Architecture	Sectored
Boot Block	No	Block Organization	Symmetrical
Address Bus Width (bit)	1	Sector Size	4Kbyte x 2048
Page Size	256byte	Number of Bits/Word (bit)	8/16
Number of Words	64M/32M	Programmability	Yes
Timing Type	Synchronous	Max. Access Time (ns)	8
Maximum Erase Time (s)	80/Chip	Maximum Programming Time (ms)	3/Page
Process Technology	110nm, CMOS	Interface Type	Serial (SPI, Dual SPI)
Minimum Operating Supply Voltage (V)	2.7	Typical Operating Supply Voltage (V)	3.3
Maximum Operating Supply Voltage (V)	3.6	Programming Voltage (V)	2.7 to 3.6
Operating Current (mA)	25	Program Current (mA)	20
Minimum Operating Temperature (°C)	-40	Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Industrial	Command Compatible	Yes
ECC Support	No	Support of Page Mode	No
Minimum Endurance (Cycles)	100000(Typ)	Mounting	Surface Mount
PCB changed	16	Pin Count	16
Lead Shape	Gull-wing	Package/Case	SOP-16

MX25L6406EMI-12G FAQs

1.Q: What is the maximum erase/program time for the MX25L6406EMI-12G?

A: Max erase time is 80s (full chip), and max page program time is 3ms per 256-byte page.

2.Q: Does the MX25L6406EMI-12G support industrial certifications?

A: It is industrial-grade (operating temp -40°C to +85°C) but lacks automotive (AEC-Q100) or PPAP certifications. ECCN is EAR99.

3.Q: What are the recommended operating conditions for the MX25L6406EMI-12G?

A: Operate at 2.7V–3.6V VCC, -40°C to +85°C, with max 25mA active current. SPI clock up to 104MHz (synchronous mode).

4.Q: What is the package type of the MX25L6406EMI-12G?

A: It comes in a 16-pin SOIC package (7.50mm width, 10.3mm length) with gull-wing leads for surface mounting.

5.Q: What are the absolute maximum ratings for the MX25L6406EMI-12G?

A: Absolute max ratings: VCC = 4.0V, input voltage = VCC + 0.5V, storage temp = -65°C to +150°C. Exceeding these may damage the device.

6.Q: What are the typical applications for the MX25L6406EMI-12G?

A: Common applications include embedded systems, networking equipment, set-top boxes, IoT devices, and firmware storage in industrial electronics.

7.Q: What is the pinout configuration of the MX25L6406EMI-12G?

A: The MX25L6406EMI-12G uses a 16-pin SOIC package with standard SPI pins (CS#, SCK, SI, SO) and dual I/O support (IO0-IO3 for Dual SPI mode).

8.Q: What are the key features of the MX25L6406EMI-12G?

A: Key features include 64Mb NOR Flash, SPI/Dual SPI interface, 2.7V–3.6V supply voltage, 100K endurance cycles, 110nm CMOS technology, and industrial temperature range (-40°C to +85°C).

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Returns and exchanges are supported, provided the items remain in their original condition.

Ratings and Reviews

N

N**h
04/21/2025

12

Excellent module. Connect quickly, does not talk too much, plays loudly, without noise, channels are not confused.Thank you!It was almost 5 days.
A

A**y
11/10/2022

4

Great price, quality products and on time delivery..\n\nArne
S

S**l
10/19/2020

5

The goods were delivered to belarus in two weeks. Very fast shipping.

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