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MMIX1F230N20T Image
MMIX1F230N20T Image

Images are for reference only See technical specifications

MMIX1F230N20T

In Stock: 4,734

Low voltage drop N-channel enhancement mode MOSFET

MMIX1F230N20T Information

Description

Weighing only 8g, the SMPD package is much lighter (typically by 50%)than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink formultiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portableappliances, increasing the life expectancy and reliability of these devices.
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Features

  • Ultra-low and compact package profile
  • Surface mountable via standard reflow process
  • Low package weight
  • Up to 4500V ceramic isolation (DCB)
  • Low package inductance
  • Excellent thermal performance
  • High power cycling capability
  • Configurations:
  • Buck
  • Boost
  • Full-bridge
  • Half-bridge
  • Phase leg
  • Single

Applications

  • Battery chargers
  • Switching and resonant power supplies
  • DC choppers
  • DC-DC converters
  • Temperature and Lighting controls
  • Motor drives
  • E-bikes and electric and hybrid vehicles
  • Solar inverters
  • Induction heaters

Specifications

Drain-Source Voltage (V) 200 Maximum On-Resistance @ 25 ℃ (Ohm) 0.0083
Continuous Drain Current @ 25 ℃ (A) 168 Gate Charge (nC) 358
Input Capacitance, CISS (pF) 24000 Thermal resistance [junction-case] (K/W) 0.22
Configuration Single Power Dissipation (W) 680
Maximum Reverse Recovery (ns) 200 Sample Request No
Check Stock Yes Package/Case SMPD-24

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Tel: +852 95804164


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    HK warehouse

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