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KHBAC4A03D-MC1H +BOM

High bandwidth memory is a type of DRAM that has a very high speed.

KHBAC4A03D-MC1H Information

Description

The KHBAC4A03D-MC1H by Samsung is an advanced memory module designed using HBM3 Icebolt technology. It features a high-density configuration optimized for applications requiring rapid data access and high-speed processing. With a density of 24 GB, it ensures robust data management. It is currently in mass production, pointing towards its reliable performance and industry acceptance.

Pinout

This module is packaged in an MPGA (Molded Pin Grid Array) format, which ensures efficient thermal management and robust physical connection. The pinout is specifically designed to support high-speed operations at 6.4 Gbps and easy integration into existing systems.

Key Features

  • Technology: Utilizes High Bandwidth Memory 3rd Generation Icebolt (HBM3 Icebolt)
  • Density: 24GB high capacity for efficient data processing
  • Organization: Features a 1024 organization, allowing for rapid data retrieval and storage
  • Package: Comes in a reliable MPGA format
  • Product Status: Available in mass production, ensuring availability and support

Applications

  • High-Performance Computing (HPC): Ideal for applications that require high-speed data processing capabilities
  • Data Centers: Suitable for use in data-intensive environments where speed and density are key
  • Artificial Intelligence: Provides the necessary speed and capacity for AI training and inference tasks

Benefits

  • Speed: High operational speed of 6.4 Gbps enhances overall system performance
  • Efficiency: Optimized for power and thermal efficiency, reducing overall system costs
  • Reliability: Mass production status indicates a mature product with proven reliability in a variety of applications

Equivalents

Similar products include offerings from other manufacturers like Micron Technology's HBM2E modules, which also provide high density and speed for comparable applications.

Manufacturer

Samsung is a globally renowned electronics company known for its expertise in state-of-the-art memory and storage solutions. The company is at the forefront of technological innovation, providing cutting-edge products that are pushing the boundaries of performance in the tech sector.

Specifications

Technology HBM3 Icebolt Density 24 GB
Organization 1024 Speed 6.4 Gbps
Refresh 32 ms Package/Case MPGA

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