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KHBAC4A03D-MC1H +BOM
High bandwidth memory is a type of DRAM that has a very high speed.
MPGA-
Manufacturer:
Samsung Electro-Mechanics
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Mfr.Part #:
KHBAC4A03D-MC1H
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Datasheet:
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Technology:
HBM3 Icebolt
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Density:
24 GB
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Organization:
1024
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Speed:
6.4 Gbps
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EDA/CAD Models:
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Availability: 7171 PCS
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KHBAC4A03D-MC1H Information
Description
The KHBAC4A03D-MC1H by Samsung is an advanced memory module designed using HBM3 Icebolt technology. It features a high-density configuration optimized for applications requiring rapid data access and high-speed processing. With a density of 24 GB, it ensures robust data management. It is currently in mass production, pointing towards its reliable performance and industry acceptance.
Pinout
This module is packaged in an MPGA (Molded Pin Grid Array) format, which ensures efficient thermal management and robust physical connection. The pinout is specifically designed to support high-speed operations at 6.4 Gbps and easy integration into existing systems.
Key Features
- Technology: Utilizes High Bandwidth Memory 3rd Generation Icebolt (HBM3 Icebolt)
- Density: 24GB high capacity for efficient data processing
- Organization: Features a 1024 organization, allowing for rapid data retrieval and storage
- Package: Comes in a reliable MPGA format
- Product Status: Available in mass production, ensuring availability and support
Applications
- High-Performance Computing (HPC): Ideal for applications that require high-speed data processing capabilities
- Data Centers: Suitable for use in data-intensive environments where speed and density are key
- Artificial Intelligence: Provides the necessary speed and capacity for AI training and inference tasks
Benefits
- Speed: High operational speed of 6.4 Gbps enhances overall system performance
- Efficiency: Optimized for power and thermal efficiency, reducing overall system costs
- Reliability: Mass production status indicates a mature product with proven reliability in a variety of applications
Equivalents
Similar products include offerings from other manufacturers like Micron Technology's HBM2E modules, which also provide high density and speed for comparable applications.
Manufacturer
Samsung is a globally renowned electronics company known for its expertise in state-of-the-art memory and storage solutions. The company is at the forefront of technological innovation, providing cutting-edge products that are pushing the boundaries of performance in the tech sector.
Specifications
Technology | HBM3 Icebolt | Density | 24 GB |
Organization | 1024 | Speed | 6.4 Gbps |
Refresh | 32 ms | Package/Case | MPGA |
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In Stock: 7,171
Minimum Order: 1
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