This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.

Images are for reference only,

See Technical Specifications

H5UG7HME03X020R +BOM

HBM3 with a density of 16Gb, a speed of 6.0Gbps, a KGSD density of 128Gb, and an organization of 1024. It's in commercial sample stage.

Manufacturer:

SK Hynix
Mfr.Part #:

H5UG7HME03X020R
Datasheet:

H5UG7HME03X020R Datasheet (PDF)
Technology:

HBM3
Density:

16Gb
Organization:

1024
Speed:

6.0Gbps

H5UG7HME03X020R Information

Description

The H5UG7HME03X020R by SK Hynix is a cutting-edge memory module designed using advanced HBM3 technology. It boasts a high-density configuration designed optimally for applications that necessitate quick access to data and swift processing. This product is currently available as a commercial sample, showcasing its potential for reliable performance and readiness for industry acceptance.

Pinout

This module is packaged in an 8Hi format. This arrangement efficiently handles thermal management while ensuring a sturdy physical connection. The pinout is purposefully laid out to lend support to high-speed operations and seamless integration into existing systems.

Key Features

Technology: Utilizes High Bandwidth Memory 3rd Generation (HBM3)
Density: 16Gb density for high-speed data processing
Organization: Features a 1024 organization, allowing for efficient data retrieval and storage
Package: Comes in a reliable 8Hi format
Product Status: Available as commercial samples, showcasing potential usability and support

Applications

High-Performance Computing (HPC): Perfectly suitable for applications requiring intensive data processing capabilities
Data Centers: Fit for use in data-rich environments where velocity and density are essential
Artificial Intelligence: Delivers the necessary speed and capacity for AI training and inferencing tasks

Benefits

Speed: 6.0Gbps operational frequency enhances overall system performance
Efficiency: Optimized for power and thermal efficiency, reducing total system costs
Reliability: The product's commercial sample status indicates a novel product poised for widespread use and proven reliability in a range of applications

Equivalents

Equivalent products might include offerings from other manufactures like Samsung’s HBM3 modules, which also provide high density and rapidity for similar applications.

Manufacturer

SK Hynix is a global leader in semiconductor technology, known for their excellence in memory and storage solutions. The experience and commitment to innovation they bring to the table translate into advanced products that drive performance in the technology sector.