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H26M78208CMR

In Stock: 7,072

Flash, 64GX8, PBGA153, FBGA-153

Manufacturers: SK HYNIX INC
Mfr.Part#:
H26M78208CMR
Package/Case:
BGA153
Product Type:
Microcontrollers
RoHS:
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H26M78208CMR Information

Description

The SK Hynix Inc. H26M78208CMR is a flash memory component, specifically a 64 Gigabit (GB) eMMC (embedded MultiMediaCard) device. It features a PBGA153 (Pin Grid Array) package with a FBGA-153 footprint. This component is designed for use in mobile devices, such as smartphones and tablets, where high-capacity storage is required. The H26M78208CMR offers fast read and write speeds, making it suitable for applications that demand rapid data transfer. As an eMMC device, the H26M78208CMR provides a reliable and efficient way to store and retrieve large amounts of data in mobile devices. Its compact PBGA153 package makes it ideal for use in space-constrained devices.

Package

According to the product information, the package type of H26M78208CMR is PBGA153 (Pseudo Ball Grid Array) or FBGA-153 (Fine Pitch Ball Grid Array).

Manufacturer

The manufacturer of the H26M78208CMR is SK Hynix Inc. SK Hynix Inc is a South Korean memory chip giant, being the world's second-largest provider of flash memory and one of the leading suppliers of DRAM (dynamic random access memory), which is an essential component for computers and other digital devices.

Specifications

Part Life Cycle Code	Active	Reach Compliance Code	compliant
ECCN Code	EAR99	HTS Code	8542.32.00.51
JESD-30 Code	R-PBGA-B153	Length	13 mm
Memory Density	549755813888 bit	Memory IC Type	FLASH
Memory Width	8	Number of Functions	1
Number of Terminals	153	Number of Words	68719476736 words
Number of Words Code	64000000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-25 °C
Organization	64GX8	Parallel/Serial	PARALLEL
Peak Reflow Temperature (Cel)	NOT SPECIFIED	Programming Voltage	3.3 V
Seated Height-Max	1 mm	Supply Voltage-Max (Vsup)	3.6 V
Supply Voltage-Min (Vsup)	2.7 V	Supply Voltage-Nom (Vsup)	3.3 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	OTHER	Terminal Form	BALL
Terminal Pitch	0.5 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED	Width	11.5 mm
Package/Case	BGA153

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AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.

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Returns and exchanges are supported, provided the items remain in their original condition.

Ratings and Reviews

J

J**a
07/04/2025

12

Delivery 24 days. The description corresponds. Quality is good.
K

K**n
01/04/2023

15

Avaq delivers on both product quality and service excellence! The FW82443BX components I received were in impeccable condition, and their delivery speed was impressive. Highly recommend their reliable and timely service!
P

P**r
03/19/2021

14

Excellent quality board

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Email: [email protected]

Teams: [email protected]

Tel: +852 95804164

Qualification

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Shipping Information

Shipped From:
HK warehouse
Expected Shipping Date:
to

(HKT)
Expected Quotation Date:
(HKT)
Supplier Lead-Time:
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*Lead times apply to standard orders and are based on business days only. Please contact us for details.

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