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210-MHz, 250-mA high-speed buffer
SOIC (D)-8Manufacturer:
Mfr.Part #:
BUF634AIDR
Datasheet:
Pbfree Code:
Yes
Part Life Cycle Code:
Active
Reach Compliance Code:
compliant
ECCN Code:
EAR99
EDA/CAD Models:
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The BUF634AIDR is a high-speed buffer from Texas Instruments, operating at 210 MHz with a current rating of 250 mA. It comes in an 8-pin SOIC package and has a temperature range of -40°C to 125°C. This device is designed for high-frequency applications where low power consumption and compact size are crucial. The BUF634AIDR features include high speed, low power, and compact size, making it suitable for use in various applications such as data transmission systems, telecommunications equipment, and computer peripherals. Its robust design and efficient functionality ensure reliable performance and long-lasting operation. Overall, the BUF634AIDR is a reliable and efficient buffer solution for high-speed applications where space and power consumption are limited.
According to the product information, the features of BUF634AIDR are:
The package type of BUF634AIDR is SOIC (D)-8.
The manufacturer of the BUF634AIDR is Texas Instruments (TI). Texas Instruments is a leading semiconductor company that designs, manufactures, and tests semiconductors and related technologies. They are known for their wide range of products, including analog and embedded processing chips, as well as other electronic components.
As per Texas Instruments' documentation, the equivalent product for BUF634AIDR is BU21013. It's a high-speed buffer with similar specifications, such as operating frequency up to 210 MHz and current consumption of 250 mA. However, please note that TI reserves the right to change or discontinue products without notice, so it's always best to check with their official documentation for the most up-to-date information.
Source Content uid | BUF634AIDR | Pbfree Code | Yes |
Part Life Cycle Code | Active | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code | 8542.39.00.01 |
Date Of Intro | 2019-03-03 | Amplifier Type | BUFFER |
Average Bias Current-Max (IIB) | 1.6 µA | Bandwidth (3dB)-Nom | 210 MHz |
Bias Current-Max (IIB) @25C | 1.6 µA | Input Offset Voltage-Max | 60000 µV |
JESD-30 Code | R-PDSO-G8 | JESD-609 Code | e4 |
Length | 4.905 mm | Moisture Sensitivity Level | 2 |
Neg Supply Voltage Limit-Max | -20 V | Neg Supply Voltage-Nom (Vsup) | -15 V |
Number of Functions | 1 | Number of Terminals | 8 |
Operating Temperature-Max | 125 °C | Operating Temperature-Min | -40 °C |
Packing Method | TR | Peak Reflow Temperature (Cel) | 260 |
Seated Height-Max | 1.75 mm | Slew Rate-Nom | 3750 V/us |
Supply Current-Max | 12 mA | Supply Voltage Limit-Max | 20 V |
Supply Voltage-Nom (Vsup) | 15 V | Surface Mount | YES |
Temperature Grade | AUTOMOTIVE | Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal Form | GULL WING | Terminal Pitch | 1.27 mm |
Terminal Position | DUAL | Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Unity Gain BW-Nom | 210000 | Width | 3.895 mm |
Package/Case | SOIC (D)-8 |
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