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BSP250,115

In Stock: 4,726

Reel-packaged transistor suitable for high-current applications

BSP250,115 Information

Description

The Nexperia BSP250,115 is a Trans MOSFET (Terminal-Type Power MOSFET) with the following key characteristics:

  • Type: P-Channel MOSFET
  • Voltage Rating: 30V
  • Current Rating: 3A
  • Package: SC-73-4 (a 4-pin package with 3 pins and one tab)
  • Pin configuration is 3+Tab

This device is suitable for switching applications where high current and low voltage are required. Its compact footprint, in the SC-73-4 package, makes it suitable for a variety of industries such as telecommunications, automotive, and industrial control systems.

The BSP250,115 can be used as a logic level mosfet or a standard power MOSFET, depending on the application.

Features

According to the provided product information, the features of BSP250,115 are:

  • Trans MOSFET P-CH (P-channel enhancement-mode MOSFET)
  • Operating voltage: 30V
  • Current rating: 3A
  • Package type: SC-73-4 with 3 leads and tab

These features make it suitable for electronic circuits or devices that require a high-voltage, low-current switching element.

Package

The package type of BSP250,115 is SC-73-4, which is a 3-pin surface-mount device (SMD) with a tab (3+Tab) configuration.

Pinout

According to the product information, the BSP250,115 has a package type of SC-73-4, which means it has a 4-pin (3+Tab) configuration. The pin count is therefore 4. The tabpin is used for thermal dissipation and is not electrically connected.

The 4 pins are likely:

  • Drain (D)
  • Source (S)
  • Gate (G)
  • Tab (for thermal management)

This information can be inferred from the product description, which indicates it's a Trans MOSFET P-CH 30V 3A. The tabpin is a common feature in power MOSFETs and is designed to help dissipate heat generated during operation.

Manufacturer

The manufacturer of the BSP250,115 is Nexperia. Nexperia is a leading global provider of semiconductor components, including MOSFETs, analog switches, and other power management devices. They are a well-established company with a strong reputation in the industry for producing high-quality products that meet the needs of various applications.

Specifications

Source Content uid BSP250,115 Part Life Cycle Code Not Recommended
Pin Count 4 Reach Compliance Code compliant
ECCN Code EAR99 Date Of Intro 2017-02-01
Application SWITCHING Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE FET Technology METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PDSO-G4 Moisture Sensitivity Level 1
Number of Elements 1 Number of Terminals 4
Operating Mode ENHANCEMENT MODE Peak Reflow Temperature (Cel) 260
Polarity/Channel Type P-CHANNEL Surface Mount YES
Terminal Finish TIN Terminal Form GULL WING
Terminal Position DUAL Time@Peak Reflow Temperature-Max (s) 30
Transistor Element Material SILICON FET Type P-Channel
Technology MOSFET (Metal Oxide) Drain to Source Voltage (Vdss) 30 V
Current - Continuous Drain (Id) @ 25°C 3A (Tc) Drive Voltage (Max Rds On, Min Rds On) 10V
Rds On (Max) @ Id, Vgs 250mOhm @ 1A, 10V Vgs(th) (Max) @ Id 2.8V @ 1mA
Gate Charge (Qg) (Max) @ Vgs 25 nC @ 10 V Vgs (Max) ±20V
Input Capacitance (Ciss) (Max) @ Vds 250 pF @ 20 V Power Dissipation (Max) 1.65W (Ta)
Operating Temperature 150°C (TJ) Mounting Type Surface Mount
Base Product Number BSP250 Package/Case SOT-223-3

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