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AT28HC256-90SU

5V High-Speed 256Kbit (32Kbit x 8) Parallel EEPROM.

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AT28HC256-90SU General Description

The Microchip AT28HC256is a high-performance 256Kbit Parallel EEPROM available in both Industrial andMilitary temp ranges, offering access times to 70ns with power dissipation of440mW. Deselected, CMOS standby current is less than 5mA. Accessed like staticRAM for the read or write cycle without external components, it contains a64-byte page register to allow writing of up to 64 bytes simultaneously. Featuresan internal Error Correction Circuit forextended endurance and improved data retention, in Military version. Optional Software Data Protection mechanism guardsagainst inadvertent writes; and an extra 64 bytes of EEPROM enables deviceidentification or tracking.

The AT28HC256 is also available DUAL MARKED where applicable with the appropriate Standard Military Drawing Number - 5962-886340xxx. See the datasheet for exact MIL product availability.

Microchip Technology, Inc Inventory

Key Features

  • 32 Kbits x 8 (256 Kbit)
  • 5V ± 10% Supply
  • Parallel Interface
  • AT28HC256E - High Endurance 100K Write Cycles Option
  • AT28HC256F - 3 ms Fast Write Option
  • 70ns access time
  • Self-Timed Erase and Write Cycles (10 ms max)
  • Page Write and Byte Write
  • Data Polling for end of write detection
  • Low Power Consumption
  • Read / Write current 80 mA (Max)
  • Standby current TTL 3 mA (Max), CMOS 300 µA (Max)
  • Write-Protection
  • Hardware Protection
  • Software Data Protect
  • Data retention > 10 years
  • Temperature Ranges
  • Standard Temperature Range: -40°C to 85°C
  • Military Temperature Range: -55°C to 125°C
  • Available in Green (Pb/Halide-free) Packaging
  • 32-lead, Plastic J-leaded Chip Carrier (PLCC)
  • 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
  • 28-lead, Plastic Thin Small Outline Package (TSOP)
  • Available in Dual marked (5962-886340xxx) CERAMIC Hermetic Packaging
  • 28-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip)
  • 28-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack)
  • 32-Pad, Non-windowed, Ceramic, Leadless Chip Carrier (LCC)
Microchip Technology, Inc Original Stock

Specifications

Category Integrated Circuits (ICs)MemoryMemory Mfr Microchip Technology
Series - Package Tube
Product Status Active Memory Type Non-Volatile
Memory Format EEPROM Technology EEPROM
Memory Size 256Kbit Memory Organization 32K x 8
Memory Interface Parallel Write Cycle Time - Word, Page 10ms
Access Time 90 ns Voltage - Supply 4.5V ~ 5.5V
Operating Temperature -40°C ~ 85°C (TC) Mounting Type Surface Mount
Package / Case 28-SOIC (0.295", 7.50mm Width) Supplier Device Package 28-SOIC
Base Product Number AT28HC256

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shipping Shipping And Packing
Shipping Method

Our products are mainly transported and delivered by DHL, FedEx, UPS and other logistics partners on site -- Available to 200+ countries.

Packing

AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.

warranty Warranty & Returns

Our policies and procedures are designed to ensure compliance with various quality specifications and to quickly resolve quality-related issues.

We promise to provide 365 days quality assurance service for all our products.

If you have any dissatisfaction with the quality of the product you received, you can contact us for a refund or exchange, as long as the product is kept in its original condition.

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Availability: 5184 PCS

Qty. Unit Price(USD) Ext. Price
1+ $9.291 $9.29
200+ $3.597 $719.40
500+ $3.469 $1,734.50
1000+ $3.408 $3,408.00

The prices below are for reference only.