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AMBE2000-10 +BOM

High-density PQFP package for space-efficient circuit design

AMBE2000-10 Information

Key Features

  • Specifications per DSCC VID V62/07621
  • Full Mil-Temp Electrical Performance from -55°C to +125°C
  • Controlled Baseline with One Wafer Fabrication Site and One Assembly/Test Site
  • Full Homogenous Lot Processing in Wafer Fab
  • No Combination of Wafer Fabrication Lots in Assembly
  • Full Traceability Through Assembly and Test by Date/Trace Code Assignment
  • Enhanced Process Change Notification
  • Enhanced Obsolescence Management
  • Eliminates Need for Up-Screening a COTS Component
  • 1A MOSFET Gate Driver
  • 90μA Start-up Current, 125μA Maximum
  • 35ns Propagation Delay Current Sense to Output
  • Fast Transient Response with Peak Current Mode Control
  • 30V Operation
  • Adjustable Switching Frequency to 2MHz
  • 20ns Rise and Fall Times with 1nF Output Load
  • Trimmed Timing Capacitor Discharge Current for Accurate Deadtime/Maximum Duty Cycle Control
  • 1.5MHz Bandwidth Error Amplifier
  • Tight Tolerance Voltage Reference Over Line, Load and Temperature
  • ±3% Current Limit Threshold

Specifications

Part Life Cycle Code Obsolete JESD-30 Code S-PQFP-G100
Number of Terminals 100 Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C Power Supplies 3.3 V
Qualification Status Not Qualified Supply Voltage-Nom 3.3 V
Surface Mount YES Telecom IC Type TELECOM CIRCUIT
Temperature Grade INDUSTRIAL Terminal Form GULL WING
Terminal Pitch 0.5 mm Terminal Position QUAD
Package/Case QFP

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