This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.

AM3352BZCZ60 +BOM

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 324-NFBGA (15x15)

AM3352BZCZ60 General Description

In addition to its strong processing capabilities, the AM3352BZCZ60 also boasts a PowerVR SGX530 graphics engine for 3D graphics acceleration, as well as a dedicated programmable real-time unit (PRU) for precise real-time control applications. With 256KB of on-chip L2 cache memory and 176KB of on-chip RAM, this SoC provides ample memory for demanding tasks

Key Features

  • Up to 1-GHz Sitara™ ARM® Cortex®-A8 32‑Bit RISC Processor
    • NEON™ SIMD Coprocessor
    • 32KB of L1 Instruction and 32KB of Data Cache With Single-Error Detection (Parity)
    • 256KB of L2 Cache With Error Correcting Code (ECC)
    • 176KB of On-Chip Boot ROM
    • 64KB of Dedicated RAM
    • Emulation and Debug - JTAG
    • Interrupt Controller (up to 128 Interrupt Requests)
  • On-Chip Memory (Shared L3 RAM)
    • 64KB of General-Purpose On-Chip Memory Controller (OCMC) RAM
    • Accessible to All Masters
    • Supports Retention for Fast Wakeup
  • External Memory Interfaces (EMIF)
    • mDDR(LPDDR), DDR2, DDR3, DDR3L Controller:
      • mDDR: 200-MHz Clock (400-MHz Data Rate)
      • DDR2: 266-MHz Clock (532-MHz Data Rate)
      • DDR3: 400-MHz Clock (800-MHz Data Rate)
      • DDR3L: 400-MHz Clock (800-MHz Data Rate)
      • 16-Bit Data Bus
      • 1GB of Total Addressable Space
      • Supports One x16 or Two x8 Memory Device Configurations
    • General-Purpose Memory Controller (GPMC)
      • Flexible 8-Bit and 16-Bit Asynchronous Memory Interface With up to Seven Chip Selects (NAND, NOR, Muxed-NOR, SRAM)
      • Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
      • Uses Hamming Code to Support 1-Bit ECC
    • Error Locator Module (ELM)
      • Used in Conjunction With the GPMC to Locate Addresses of Data Errors from Syndrome Polynomials Generated Using a BCH Algorithm
      • Supports 4-, 8-, and 16-Bit per 512-Byte Block Error Location Based on BCH Algorithms
  • Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
    • Supports Protocols such as EtherCAT®, PROFIBUS, PROFINET, EtherNet/IP™, and More
    • Two Programmable Real-Time Units (PRUs)
      • 32-Bit Load/Store RISC Processor Capable of Running at 200 MHz
      • 8KB of Instruction RAM With Single-Error Detection (Parity)
      • 8KB of Data RAM With Single-Error Detection (Parity)
      • Single-Cycle 32-Bit Multiplier With 64-Bit Accumulator
      • Enhanced GPIO Module Provides Shift-In/Out Support and Parallel Latch on External Signal
    • 12KB of Shared RAM With Single-Error Detection (Parity)
    • Three 120-Byte Register Banks Accessible by Each PRU
    • Interrupt Controller (INTC) for Handling System Input Events
    • Local Interconnect Bus for Connecting Internal and External Masters to the Resources Inside the PRU-ICSS
    • Peripherals Inside the PRU-ICSS:
      • One UART Port With Flow Control Pins, Supports up to 12 Mbps
      • One Enhanced Capture (eCAP) Module
      • Two MII Ethernet Ports that Support Industrial Ethernet, such as EtherCAT
      • One MDIO Port
  • Power, Reset, and Clock Management (PRCM) Module
    • Controls the Entry and Exit of Stand-By and Deep-Sleep Modes
    • Responsible for Sleep Sequencing, Power Domain Switch-Off Sequencing, Wake-Up Sequencing, and Power Domain Switch-On Sequencing
    • Clocks
      • Integrated 15- to 35-MHz High-Frequency Oscillator Used to Generate a Reference Clock for Various System and Peripheral Clocks
      • Supports Individual Clock Enable and Disable Control for Subsystems and Peripherals to Facilitate Reduced Power Consumption
      • Five ADPLLs to Generate System Clocks (MPU Subsystem, DDR Interface, USB and Peripherals [MMC and SD, UART, SPI, I2C], L3, L4, Ethernet, GFX [SGX530], LCD Pixel Clock)
    • Power
      • Two Nonswitchable Power Domains (Real-Time Clock [RTC], Wake-Up Logic [WAKEUP])
      • Three Switchable Power Domains (MPU Subsystem [MPU], SGX530 [GFX], Peripherals and Infrastructure [PER])
      • Implements SmartReflex™ Class 2B for Core Voltage Scaling Based On Die Temperature, Process Variation, and Performance (Adaptive Voltage Scaling [AVS])
      • Dynamic Voltage Frequency Scaling (DVFS)
  • Real-Time Clock (RTC)
    • Real-Time Date (Day-Month-Year-Day of Week) and Time (Hours-Minutes-Seconds) Information
    • Internal 32.768-kHz Oscillator, RTC Logic and 1.1-V Internal LDO
    • Independent Power-on-Reset (RTC_PWRONRSTn) Input
    • Dedicated Input Pin (EXT_WAKEUP) for External Wake Events
    • Programmable Alarm Can be Used to Generate Internal Interrupts to the PRCM (for Wakeup) or Cortex-A8 (for Event Notification)
    • Programmable Alarm Can be Used With External Output (PMIC_POWER_EN) to Enable the Power Management IC to Restore Non-RTC Power Domains
  • Peripherals
    • Up to Two USB 2.0 High-Speed DRD (Dual-Role Device) Ports With Integrated PHY
    • Up to Two Industrial Gigabit Ethernet MACs (10, 100, 1000 Mbps)
      • Integrated Switch
      • Each MAC Supports MII, RMII, RGMII, and MDIO Interfaces
      • Ethernet MACs and Switch Can Operate Independent of Other Functions
      • IEEE 1588v1 Precision Time Protocol (PTP)
    • Up to Two Controller-Area Network (CAN) Ports
      • Supports CAN Version 2 Parts A and B
    • Up to Two Multichannel Audio Serial Ports (McASPs)
      • Transmit and Receive Clocks up to 50 MHz
      • Up to Four Serial Data Pins per McASP Port With Independent TX and RX Clocks
      • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
      • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
      • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Up to Six UARTs
      • All UARTs Support IrDA and CIR Modes
      • All UARTs Support RTS and CTS Flow Control
      • UART1 Supports Full Modem Control
    • Up to Two Master and Slave McSPI Serial Interfaces
      • Up to Two Chip Selects
      • Up to 48 MHz
    • Up to Three MMC, SD, SDIO Ports
      • 1-, 4- and 8-Bit MMC, SD, SDIO Modes
      • MMCSD0 has Dedicated Power Rail for 1.8‑V or 3.3-V Operation
      • Up to 48-MHz Data Transfer Rate
      • Supports Card Detect and Write Protect
      • Complies With MMC4.3, SD, SDIO 2.0 Specifications
    • Up to Three I2C Master and Slave Interfaces
      • Standard Mode (up to 100 kHz)
      • Fast Mode (up to 400 kHz)
    • Up to Four Banks of General-Purpose I/O (GPIO) Pins
      • 32 GPIO Pins per Bank (Multiplexed With Other Functional Pins)
      • GPIO Pins Can be Used as Interrupt Inputs (up to Two Interrupt Inputs per Bank)
    • Up to Three External DMA Event Inputs that can Also be Used as Interrupt Inputs
    • Eight 32-Bit General-Purpose Timers
      • DMTIMER1 is a 1-ms Timer Used for Operating System (OS) Ticks
      • DMTIMER4–DMTIMER7 are Pinned Out
    • One Watchdog Timer
    • SGX530 3D Graphics Engine
      • Tile-Based Architecture Delivering up to 20 Million Polygons per Second
      • Universal Scalable Shader Engine (USSE) is a Multithreaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Advanced Shader Feature Set in Excess of Microsoft VS3.0, PS3.0, and OGL2.0
      • Industry Standard API Support of Direct3D Mobile, OGL-ES 1.1 and 2.0, and OpenMax
      • Fine-Grained Task Switching, Load Balancing, and Power Management
      • Advanced Geometry DMA-Driven Operation for Minimum CPU Interaction
      • Programmable High-Quality Image Anti-Aliasing
      • Fully Virtualized Memory Addressing for OS Operation in a Unified Memory Architecture
    • LCD Controller
      • Up to 24-Bit Data Output; 8 Bits per Pixel (RGB)
      • Resolution up to 2048 × 2048 (With Maximum 126-MHz Pixel Clock)
      • Integrated LCD Interface Display Driver (LIDD) Controller
      • Integrated Raster Controller
      • Integrated DMA Engine to Pull Data from the External Frame Buffer Without Burdening the Processor via Interrupts or a Firmware Timer
      • 512-Word Deep Internal FIFO
      • Supported Display Types:
        • Character Displays - Uses LIDD Controller to Program these Displays
        • Passive Matrix LCD Displays - Uses LCD Raster Display Controller to Provide Timing and Data for Constant Graphics Refresh to a Passive Display
        • Active Matrix LCD Displays - Uses External Frame Buffer Space and the Internal DMA Engine to Drive Streaming Data to the Panel
    • 12-Bit Successive Approximation Register (SAR) ADC
      • 200K Samples per Second
      • Input can be Selected from any of the Eight Analog Inputs Multiplexed Through an 8:1 Analog Switch
      • Can be Configured to Operate as a 4-Wire, 5-Wire, or 8-Wire Resistive Touch Screen Controller (TSC) Interface
    • Up to Three 32-Bit eCAP Modules
      • Configurable as Three Capture Inputs or Three Auxiliary PWM Outputs
    • Up to Three Enhanced High-Resolution PWM Modules (eHRPWMs)
      • Dedicated 16-Bit Time-Base Counter With Time and Frequency Controls
      • Configurable as Six Single-Ended, Six Dual-Edge Symmetric, or Three Dual-Edge Asymmetric Outputs
    • Up to Three 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
  • Device Identification
    • Contains Electrical Fuse Farm (FuseFarm) of Which Some Bits are Factory Programmable
      • Production ID
      • Device Part Number (Unique JTAG ID)
      • Device Revision (Readable by Host ARM)
  • Debug Interface Support
    • JTAG and cJTAG for ARM (Cortex-A8 and PRCM), PRU-ICSS Debug
    • Supports Device Boundary Scan
    • Supports IEEE 1500
  • DMA
    • On-Chip Enhanced DMA Controller (EDMA) has Three Third-Party Transfer Controllers (TPTCs) and One Third-Party Channel Controller (TPCC), Which Supports up to 64 Programmable Logical Channels and Eight QDMA Channels. EDMA is Used for:
      • Transfers to and from On-Chip Memories
      • Transfers to and from External Storage (EMIF, GPMC, Slave Peripherals)
  • Inter-Processor Communication (IPC)
    • Integrates Hardware-Based Mailbox for IPC and Spinlock for Process Synchronization Between Cortex-A8, PRCM, and PRU-ICSS
      • Mailbox Registers that Generate Interrupts
        • Four Initiators (Cortex-A8, PRCM, PRU0, PRU1)
      • Spinlock has 128 Software-Assigned Lock Registers
  • Security
    • Crypto Hardware Accelerators (AES, SHA, RNG)
    • Secure Boot (optional; requires custom part engagement with TI)
  • Boot Modes
    • Boot Mode is Selected Through Boot Configuration Pins Latched on the Rising Edge of the PWRONRSTn Reset Input Pin
  • Packages:
    • 298-Pin S-PBGA-N298 Via Channel Package
      (ZCE Suffix), 0.65-mm Ball Pitch
    • 324-Pin S-PBGA-N324 Package
      (ZCZ Suffix), 0.80-mm Ball Pitch

Specifications

Product Name AM3352BZCZ60 Product Type Microprocessor
Core Processor ARM Cortex-A8 Core Frequency 600MHz
Operating Voltage 1.1V Operating Temperature Range -40°C to +105°C
Data Bus Width 32-Bit Instruction Set Architecture ARMv7
Cache 32KB L1 Instruction Cache, 32KB L1 Data Cache Memory Type DDR3, LPDDR2, DDR2
Number of UARTs 6 Number of SPIs 5
Number of I2Cs 2 Number of PWM Channels 8
Number of GPIOs 144 Source Content uid AM3352BZCZ60
Pbfree Code Yes Part Life Cycle Code Active
Reach Compliance Code compliant ECCN Code 5A992.C
HTS Code 8542.31.00.01 Address Bus Width 28
Bit Size 32 Boundary Scan YES
External Data Bus Width 16 Format FIXED POINT
Integrated Cache YES JESD-30 Code S-PBGA-B324
Low Power Mode YES Moisture Sensitivity Level 3
Number of DMA Channels 64 Number of Terminals 324
On Chip Data RAM Width 8 Peak Reflow Temperature (Cel) 260
RAM (words) 131072 Surface Mount YES
Technology CMOS Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER Terminal Form BALL
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) 30
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Service Policies and Others

After-Sales & Settlement Related

payment Payment

Payment Method

hsbc
TT/Wire Transfer
paypal
Paypal
wu
Western Union
mg
Money Gram

For alternative payment channels, please reach out to us at:

[email protected]
shipping Shipping & Packing

Shipping Method

fedex
Fedex
ups
UPS
dhl
DHL
tnt
NTN
Packing

AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.

Warranty Warranty

We promise to provide 365 days quality assurance service for all our products.

Ratings and Reviews

More
N
N**s 11/16/2023

Avaq is my go-to supplier for electronic components, and they did not disappoint with the AM3352BZCZ60 batch. The components were pristine and performed exceptionally well. A trustworthy distributor indeed! - Impressed buyer

12
C
C**a 06/26/2023

Avaq truly understands the value of customer satisfaction. From the moment I placed my order to the timely delivery of the AM3352BZCZ60 components, they kept me informed and ensured a smooth experience. Great customer service! - Unparalleled customer satisfaction

15
B
B**y 03/05/2023

Avaq has solidified its position as a leader in customer service. Not only did they promptly respond to my inquiries, but they also ensured a hassle-free purchase and delivery of the AM3352BZCZ60 components. Exceptional service, highly recommended! - Outstanding customer support

12
C
C**m 02/06/2023

The AM3352BZCZ60 components from Avaq exceeded my expectations! These brand new devices worked flawlessly in my electronic project, proving their authenticity and top-notch quality. Highly recommend! - Satisfied customer

11

Reviews

You need to log in to reply. Sign In | Sign Up

In Stock: 4,527

Minimum Order: 1

Qty. Unit Price Ext. Price
1+ $9.082 $9.08
10+ $7.888 $78.88
30+ $7.160 $214.80
100+ $6.548 $654.80

The prices below are for reference only.